Interconnect Solutions Blog

For OEMs in need of a 110D connecting block solution, I wanted to make you aware of a Cost Savings Analysis available from Siemon Interconnect Solutions that shows the time and materials cost reductions from Siemon’s unique EON (eye of the needle) press fit 110D style connecting block design.

Siemon’s solderless press fit connectors reduce costs by eliminating the need to solder the 110D connecting blocks to a PCB (printed circuit board) and the processing time associated with the soldering process.

Customers have the option to terminate either 22-26AWG (0.64mm-0.40mm) solid or 7-strand conductors using IDC (insulation displacement contact) technology.

Siemon’s Interconnect Solutions business unit (SIS) is a team of experts committed to solving industry and customer-driven interconnect challenges. SIS specializes in the development of copper and fiber high-speed interconnects for the communications, data center, medical, automotive and industrial markets, providing value-added solutions across a variety of markets and customer applications. With over 400 patents, Siemon invests heavily in R&D and development of industry standards, underlining the company’s long-term commitment to its customers and the industry.