Grounding and bonding is integral to the proper performance of both electrical and telecommunications systems.
ANSI/TIA-607-B Generic “Telecommunications Bonding and Grounding (Earthing) for Customer Premises” was developed by the TIA TR-42.16 Grounding and Bonding Subcommittee and published in August, 2012. This Standard provides basic principles, components, and design of telecommunications bonding and grounding that shall be followed to ensure that the telecommunication bonding and grounding systems within a building will have one electrical potential.
ANSI/TIA-607-B-1 “Addendum 1, External Grounding” was published in January, 2013 and expands the content of TIA-607-B by summarizing the requirements for a structure’s electrical grounding electrode system and providing additional design and testing requirements for a telecommunications grounding electrode system.
ANSI/TIA-607-B-2: “Addendum 2, Structural Metal” was published in August, 2013 and provides additional requirements for a telecommunications bonding and grounding system when structural metal is used as the telecommunications bonding backbone instead of the telecommunications bonding backbone (TBB) or grounding equalizer (GE).
- Overview of Telecommunication Grounding and Bonding Systems
- Telecommunications Grounding and Bonding Components
- Design Requirements
- Performance and Test Requirements
- Annexes addressing Grounding Electrodes, Towers and Antennas, Telecommunications Electrical Protection, Electrical Protection for Operator-Type Equipment Positions, and Cross Reference of Terms
- Grounding Resistance
- Telecommunications Grounding Electrode System Design
- Grounding Electrode System Testing
- Annex addressing Soil Resistivity Testing
- Telecommunications Bonding and Grounding System Using Structural Metal
Grounding Requirements for Shielded versus Unshielded Cabling Systems
The grounding requirements for shielded cabling systems are identical to those specified for unshielded cabling systems with the exception of the following additional step:
- the shield shall be bonded to the telecommunications main grounding busbar (TMGB) or the telecommunications grounding busbar (TGB) where the cables are terminated or where pairs are “broken out” from the cable sheath
For shielded connecting hardware that self-grounds to the patch panel, this may be accomplished by connecting a 12 AWG stranded wire from the ground point (or lug) provided on the patch panel to the TMGB or TGB.