Grounding and bonding is integral to the reliable performance of both electrical and telecommunications systems.

ANSI/TIA-607-C Generic “Telecommunications Bonding and Grounding (Earthing) for Customer Premises” was developed by the TIA TR-42.16 Grounding and Bonding Subcommittee and published in November, 2015.  This Standard provides basic principles, components, and design of telecommunications bonding and grounding that shall be followed to ensure that the telecommunication bonding and grounding systems within a building will have one electrical potential.

Significant changes from the previous edition include:

  • Incorporation of the requirements for a structure’s electrical grounding electrode system and the additional telecommunications grounding electrode system design and testing requirements from TIA-607-B.1
  • Addition of the requirements for a telecommunications bonding and grounding system for the case when structural metal is used as the telecommunications bonding backbone from TIA‑607-B.2
  • Inclusion of an illustrative example of the generic telecommunications bonding infrastructure in a single story large building
  • Addition of recommendations for bonding connections for separately divided systems
  • New component and design requirements for rack bonding busbars
  • Adoption of a minimum bend radius and angle requirements for bonding conductors
  • Expanded listing of insulated conductors required to be color-coded green
  • New recommendation for a minimum 0.6m (2 ft) grid spacing for mesh bonding networks
  • Clarification that patch panels for shielded cabling shall be bonded
  • Clarification that bonding requirements apply to all metallic telecommunications pathways
  • Additional requirement that exothermic two-hole lugs, when used to make connections to the primary bonding busbar (PBB), be listed

ANSI/TIA-607-C-1 “Addendum 1, Bonding in Multi-tenant Buildings” published in January, 2017 and expands upon the scope of TIA-607-C to include bonding and grounding requirements in buildings serving more than one tenant. This Standard describes a common bonding infrastructure for telecommunications equipment providing shared services and the connection of individual tenant bonding infrastructures to the common bonding infrastructure when present or to the equipment (power) ground when a common bonding infrastructure is not present.

ANSI/TIA-607-C Content

  • Regulatory
  • Overview of Telecommunication Grounding and Bonding Systems
  • Telecommunications Bonding Components
  • Design Requirements
  • External Grounding
  • Performance and Test Requirements
  • Annexes addressing Bonding Methods, Grounding Electrodes, Towers and Antennas, Telecommunications Electrical Protection, Electrical Protection for Operator-Type Equipment Positions, and Cross Reference of Terms

ANSI/TIA-607-C-1 Content

  • Overview of the Telecommunications Bonding Infrastructure
  • Transmission Requirements
  • Annexes addressing Reliability Testing of Connecting Hardware, Measurement Requirements, Cabling and Component Test Procedures, Channel and Permanent Link Configurations with Additional Connectors and/or Cables, and Length Scaling, and Modeling Configurations

Conductor Bend Radius and Included Angle

The inside bend radius of telecommunications bonding conductors terminated at the primary bonding busbar (PBB) or secondary bonding busbar (SBB) shall have an inside bend radius of 200 mm (8 in).  At other locations, bends in the bonding conductors should be limited to the greatest practical inside bend radius with a minimum bend radius of 10 times the bonding conductor diameter recommended. In all cases, the minimum bend radius angle shall be 90° or greater.

Grounding Requirements for Shielded versus Unshielded Cabling Systems

The grounding requirements for shielded cabling systems are identical to those specified for unshielded cabling systems with the exception of the following additional step:

  • Patch panels for shielded cabling shall be bonded to the telecommunications bonding system in accordance with manufacturer instructions

Bonding of the shielded patch panel may be accomplished by connecting a 12 AWG stranded wire from the ground point (or lug) provided on the patch panel to the rack , cabinet, or enclosure, bonding conductor.

Click here for archive information on ANSI/TIA-607-B.

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